The hardness of DOHONE Wafer Dicing Rings reaches 50-55HRC, ensuring superior quality and reliability

2026-08-28

When purchasing Wafer dicing ring, exquisite appearance and robust durability are core requirements. It is highly recommended to choose well established manufacturers with rich industry experience.

 

Wafer Expander Ring Cassette

 

Some small workshops and under qualified manufacturers lack mature processing experience. Their products often have poor surface finish and fail to meet required hardness standard. Low hardness rings tend to deform during dicing process, resulting in wafer chipping and yield loss.

 

Wafer Expander Ring Cassette  Wafer Expander Ring Cassette

 

DOHONE is a mid scale manufacturer with solid experience in semiconductor carrier production. Our technical capability is comparable to large scale factories. Our Wafer dicing ring features fine appearance, smooth edges, and tested hardness of 50 55HRC. Balanced with competitive price, we maintain abundant stock for mainstream models. Orders can be shipped within 48 hours to support your production schedule.

Feel free to contact us for product datasheets and favorable quotations.

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