NEWS

IC packaging magazines are the core carrying fixtures in semiconductor packaging and testing production lines. They are widely used in two key processes—die bonding and wire bonding—mainly to carry wafers and semi-finished chips, ensuring stable positioning during transfer, processing, and circulation, and preventing collisions and scratches. As magazines circulate repeatedly on the production line over time, they come into contact with various contaminants such as flux residue, trace silicon dust, organic volatiles, hand oils, and adhesive debris. Once stains adhere to the magazine body or slots, volatile impurities are easily generated during high-temperature die bonding and wire bonding operations, contaminating chip pads and circuits, leading to poor solder joints and yield loss. Therefore, when stains appear on magazines, they must be cleaned according to the specific surface treatment process, and a one-size-fits-all cleaning approach is not acceptable. The specific treatment options are as follows:

Standard Anodized Magazines

For this basic type of anodized magazine, the surface oxide film is relatively thin and has weak resistance to solvents and ultrasonic agitation, making it unsuitable for prolonged immersion in cleaning equipment. If only light oil stains, dust, or mild organic contaminants are present on the surface, use a lint-free cloth moistened with anhydrous ethanol (industrial-grade high-purity alcohol) and wipe evenly along the grain of the magazine slots. For corners and gaps, use lint-free cotton swabs dipped in alcohol for detailed cleaning. After wiping, place the magazine on a clean bench to air-dry naturally. Confirm that no alcohol residue or water spots remain before returning it to the production line. Soaking and ultrasonic cleaning are strictly prohibited throughout the entire process to prevent whitening, film peeling, or corrosion spots on the oxide layer.

Hard Anodized Magazines (High-Temperature and Corrosion-Resistant Type)

Hard anodizing forms a dense, thick, high-hardness oxide film on the aluminum substrate, offering excellent resistance to acids, alkalis, high temperatures, and erosion, making it suitable for demanding cleaning conditions. When stubborn contaminants such as flux residue, cured dust, or heavy oils accumulate on the outer walls or internal slots and cannot be removed by ordinary wiping, the entire magazine can be placed in an ultrasonic cleaner with a semiconductor-grade neutral cleaning solution for ultrasonic agitation. After cleaning, remove the magazine and rinse thoroughly with pure water to remove any remaining cleaning agent. Then place it in a clean oven and dry at low temperature according to process specifications. After complete moisture removal, cool to room temperature, and the magazine is ready for reuse. This cleaning method does not damage the protective surface layer of the magazine, and dimensional accuracy and anti-static performance remain unaffected.

In summary, whether an IC packaging magazine can be immersed in ultrasonic cleaning or subjected to high-temperature baking is fundamentally determined by the surface anodizing process used at the time of manufacture. Production line operators must distinguish the process identification marks on the magazines in advance and strictly follow the corresponding cleaning methods to avoid issues such as oxide layer damage, leaching of impurities from the substrate, or magazine deformation caused by improper cleaning. By controlling cleanliness at the fixture source, the overall process quality of chip packaging can be stabilized, chip contamination defects reduced, and packaging yield improved.