NEWS

In the current era of surging digitalization, the semiconductor industry, as the core driving force of technological development, continues to demonstrate astonishing vitality and transformative power. Chip packaging and testing, as a crucial back-end link in the semiconductor industry chain, is now confronted with a series of emerging demands triggered by breakthroughs in cutting-edge technologies and the emergence of new application scenarios, outlining a grand blueprint full of opportunities for the industry's development.

1. High-performance computing demands drive advanced packaging technology forward

With the rapid development of high-performance computing fields such as artificial intelligence, big data analysis, and cloud computing, the requirements for chip performance have long surpassed traditional boundaries. To meet the growing demand for computing power, chip packaging technology is advancing towards more advanced and complex directions.

On the one hand, 2.5D/3D packaging technology has become the focus of the industry. By vertically stacking multiple chips or chips with other components, it significantly shortens the signal transmission path, reduces latency, and greatly increases the data transmission rate. Take artificial intelligence chips as an example. Industry giants like NVIDIA widely adopt 3D packaging technology in their high-end products, closely integrating memory chips with computing chips to achieve ultra-high-speed data interaction between memory and processors, resulting in an exponential increase in the execution efficiency of deep learning algorithms. This technology not only meets the demand for rapid reading and writing of massive data during AI training but also lays a solid foundation for more complex intelligent application scenarios in the future.

On the other hand, system-in-package (SiP) is also constantly evolving. SiP can integrate multiple chips with different functions, such as microprocessors, RF chips, sensors, etc., into a single package to form a complete miniature system. In the field of 5G smartphones, the application of SiP enables smartphones to achieve multi-function integration in a compact space. For instance, the A-series chips in Apple phones use SiP packaging to integrate numerous key components such as CPUs, GPUs, and baseband chips. This not only reduces the motherboard area but also enhances overall performance and optimizes power management, providing users with an outstanding experience. This trend prompts chip packaging and testing enterprises to increase research and development investment and improve their ability to achieve high-precision and high-reliability integration in a small space.

2. The Rise of IoT Applications Gives Rise to Diversified Packaging Forms

The vigorous development of the Internet of Things (IoT) has enabled billions of devices to be connected to the network. These devices come in various shapes and sizes and have diverse functions, ranging from micro-sensors to large industrial gateways, from wearable devices to smart home hubs. This has created unprecedented demands for diversified chip packaging.

For small-sized, low-power IoT terminal devices such as smart bracelets and wireless tags, wafer-level packaging (WLP) technology has shone brightly. WLP directly packages chips on the wafer without the need to cut them out and package them separately, significantly reducing the packaging size and lowering costs. At the same time, due to the reduction of parasitic capacitance and inductance in the packaging process, the power consumption of the chips is further reduced, and the battery life is significantly enhanced. For instance, NXP Semiconductors has launched a series of ultra-low power chips for the IoT market, which adopt WLP technology, enabling numerous micro IoT devices to operate stably for long periods, meeting the urgent demands of applications such as environmental monitoring and health tracking for small, energy-efficient chips.

For some IoT devices that need to operate in harsh environments, such as industrial sensors and automotive electronic components, packaging forms with high reliability and strong protection have become crucial. Ceramic packaging stands out due to its excellent high-temperature resistance, corrosion resistance, and high insulation performance. In automotive engine control systems, chips packaged in ceramic can operate stably in high-temperature and high-vibration harsh environments, accurately monitoring and controlling engine operation parameters, ensuring the safety and efficient operation of vehicles. Additionally, in response to the challenges of water resistance, dust resistance, and UV resistance faced by outdoor IoT devices, new encapsulation materials and processes are constantly emerging, providing comprehensive protection for chips and ensuring the reliable operation of IoT devices in various complex environments.

3. Automotive Electronics Transformation Reshapes Packaging and Testing Standards

The automotive industry is undergoing profound transformations in electrification, intelligence, and connectivity, making automotive electronic systems a new growth pole in the chip packaging and testing field and reshaping industry standards.

In the electric vehicle (EV) sector, core components such as battery management systems (BMS) and motor drive control systems have extremely high requirements for the reliability and safety of chips. Chip packaging not only needs to have excellent heat dissipation performance to handle the large amount of heat generated during high-power operation but also must pass strict automotive industry standards certifications, such as AEC-Q100. For instance, Infineon's dedicated chips for EV BMS adopt special heat dissipation packaging designs to ensure stable operation in high-temperature environments and have undergone multiple reliability tests, providing a solid guarantee for the safety and efficient management of EV batteries.

With the gradual upgrading of autonomous driving technology, from assisted driving to advanced autonomous driving and even full autonomous driving, higher demands are placed on the computing power, real-time response capabilities, and fault tolerance of on-board chips. This has driven chip packaging towards higher integration and lower latency, while the packaging and testing process needs to incorporate more functional safety testing procedures. For example, Tesla has incorporated complex fault injection tests in the packaging and testing of its autonomous driving chips, simulating various possible hardware failure scenarios to verify whether the chips can ensure the safe operation of vehicles in extreme conditions, paving the way for the large-scale commercial application of autonomous driving vehicles.

4. Green and Environmental Protection Concepts Lead the Innovation of Packaging Materials

Under the global backdrop of advocating sustainable development, the chip packaging and testing industry has also actively responded to the green and environmental protection concept, initiating an innovation journey starting from packaging materials.

Traditional chip packaging materials, such as some lead-based solders, contain harmful substances and may cause environmental pollution during production, use, and disposal. Nowadays, lead-free solders have become the industry mainstream, with tin-silver-copper (SAC) series lead-free solders widely used in chip packaging. They ensure welding quality while significantly reducing the risk of lead pollution.

In addition, bio-based degradable materials are also emerging in the packaging field. Some research teams are exploring the use of natural biomaterials such as cellulose and starch to prepare chip packaging shells or buffer materials. These materials can gradually decompose in the natural environment after the chip reaches its service life, reducing the long-term pollution of electronic waste to soil and water sources. Although bio-based materials still face challenges in terms of cost and performance stability at present, with continuous technological progress, they are expected to play a greater role in future chip packaging and contribute to the green and sustainable development of the semiconductor industry.

In conclusion, the chip packaging and testing industry is at the forefront of change. Facing the emerging demands from high-performance computing, the Internet of Things, automotive electronics, and green environmental protection, only by constantly innovating, breaking through technical bottlenecks, optimizing processes and procedures, and strengthening cross-field cooperation can it seize opportunities in the fierce global competition, write a glorious chapter in the back-end of the semiconductor industry, and inject continuous impetus into the advancement of the entire technological world.