In the vast ecosystem of the semiconductor industry, the wafer carrier, as a crucial tool ensuring the safe and efficient flow of wafers during production, transportation, and storage, is closely related to the overall trend of the semiconductor industry. In recent years, with the continuous rise in semiconductor market demand and the rapid technological iteration, the wafer carrier industry has also upgraded and iterated according to the products of its customers, presenting a series of novel and unique products.

According to data from the International Semiconductor Industry Association (SEMI), global semiconductor production capacity is expected to reach 30 million 200mm-equivalent wafers per month in 2024, representing a 6.4% increase over 2023. The expansion of semiconductor manufacturing scale has directly driven up the demand for supporting products such as wafer carriers. For instance, in the 5G communication sector, the surging demand for high-performance chips in base station construction and terminal equipment manufacturing has prompted wafer manufacturing enterprises to expand their production capacity, thereby increasing their procurement of wafer carriers. Similarly, the rapid rise of the artificial intelligence field and the strong demand for AI chips are also driving the expansion of the wafer carrier market size.

In terms of technological innovation, as semiconductor manufacturing processes evolve towards higher precision and larger wafer sizes, wafer carriers are also constantly being updated. On one hand, to accommodate larger wafers, the size specifications of the carriers are continuously adjusted. Currently, 300mm wafers have become the mainstream product. This not only requires carriers to have sufficient load-bearing strength and stability in design, but also to optimize their weight to reduce the physical strain on manual handling and enhance work efficiency. On the other hand, as the precision of semiconductor manufacturing processes improves, the anti-static requirements for wafer carriers have become more stringent. During production, any static electricity generated due to friction could potentially damage the wafers and affect the yield of chips. Therefore, companies in the industry are investing heavily in research and development, using new materials and advanced manufacturing techniques to enhance the surface wear resistance and reliable anti-static performance of wafer carriers.

In the global competitive landscape, the wafer carrier industry shows a diversified trend. In the international market, established semiconductor equipment suppliers from countries like Japan and the United States hold a dominant position in the high-end market, thanks to their profound technological accumulation, outstanding brand reputation, and extensive customer resources. Take Japan's Disco as an example. With its exquisite manufacturing techniques and strict quality control, it supplies high-quality wafer equipment and matching wafer carriers to the world's top semiconductor manufacturing enterprises. Although its products are relatively expensive, it has strong bargaining power in the high-end market. Meanwhile, as the semiconductor industry shifts.