Advantages of DOHONE 8-inch 25-Slot Wafer Frame Cassette
2025-06-20
In the back-end process of IC packaging and testing in the semiconductor industry, the 8-inch 25-Slot Wafer Frame Cassette plays a crucial role. Specifically designed for precision wafer dicing processes, this cassette forms an efficient collaborative system with wafer dicing machines. In actual production, it accurately handles and stores 8-inch wafers, featuring 25 standardized slots that provide a stable and secure placement space. This ensures the wafers remain steady during transfer and dicing, preventing damage caused by shaking or collisions, thereby guaranteeing smooth die-cutting operations.
From a product perspective, the 8-inch 25-Slot Wafer Frame Cassette achieves industry-leading precision and flatness. Manufactured using high-precision machining, the dimensional tolerances of its components are strictly controlled within an extremely small range. The slot surfaces undergo fine polishing and oxidation treatment, maintaining a flatness error of no more than 0.3mm, which ensures full-contact support for the wafers. This enhances positioning accuracy during dicing, improving die-cutting quality and yield.
Such outstanding quality allows the cassette to perfectly meet the technical requirements of mainstream wafer dicing machines worldwide. Whether paired with China’s advanced high-precision dicing machines or Japan’s highly stable automated dicing equipment, this cassette ensures seamless compatibility, guaranteeing operational stability and dicing precision. It provides semiconductor manufacturers with a reliable solution for efficient production.
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