NEWS

The wafer ring plays a crucial role in the field of semiconductor chip manufacturing. It is primarily used in conjunction with blue tape to secure the wafer onto the film for dicing and scribing processes, providing support, handling, and protection for the wafer.

Wafer rings come in various sizes. Standard sizes available on the market include 6-inch, 8-inch, and 12-inch, while custom sizes such as 4-inch and 10-inch are also available. Different sizes of wafer rings are suitable for wafers of different specifications. For example, blue tape also comes in corresponding sizes to match various wafer dimensions, with common wafer sizes including 4-inch, 6-inch, 8-inch, and 12-inch, among others. Key characteristic parameters of blue tape are thickness and adhesion strength. Most blue tape used for silicon wafer dicing has a thickness ranging from 80 to 95 micrometers. The adhesion strength of the tape must be sufficient to ensure that each separated die remains firmly attached to the film during the dicing process, while also allowing for easy removal of the dies from the tape once dicing is completed.