NEWS

In the semiconductor chip manufacturing sector, wafer dicing is a critical process that separates numerous chips on a wafer into individual units. With the continuous advancement of semiconductor technology, 6-inch wafer dicing techniques have also been evolving to meet growing market demands and technical challenges.

Challenges Facing Traditional Dicing Technologies:

Conventional mechanical dicing methods, such as those using diamond-coated blades, exhibit certain limitations in 6-inch wafer dicing. Due to the relatively larger size of 6-inch wafers, blade wear accelerates during dicing, cutting speeds are slower, and chip edges are prone to chipping and delamination. These issues are particularly pronounced for harder materials, such as silicon carbide (SiC) wafers.

Emergence of Laser Dicing Technologies:

To address the shortcomings of traditional methods, laser dicing has gradually become a key solution for 6-inch wafer dicing.

Laser Ablation: This technique uses a focused laser beam to vaporize material and form dicing grooves, but it may generate a larger heat-affected zone (HAZ), microcracks, and potential damage to the wafer's blue tape.

Water-Jet Guided Laser Dicing: By directing laser energy through a water stream, this method enables precise cutting while effectively cooling the dicing area, reducing thermal deformation and damage, and improving cutting speed.

Stealth Dicing (SD): This technology forms modified layers inside the wafer via laser irradiation, enabling high-precision separation without surface. It significantly enhances chip yield and performance.

Thermal Laser Separation (TLS): Leveraging laser-induced thermal stress and rapid cooling, TLS drives clean wafer separation with advantages such as high speed and narrower dicing streets.