NEWS

As the global semiconductor industry rapidly iterates toward high precision, high integration, and miniaturization, chip manufacturing processes continue to break through to 3nm and below. As Moore's Law enters its second half, the path relying solely on process miniaturization has gradually reached both physical and cost ceilings. As the "final step" in chip manufacturing, packaging technology has continuously risen in complexity, evolving from a traditional "assembly link" into a core hub that determines chip performance, operational reliability, and production efficiency, directly impacting market competitiveness and the ability to scale production. Whether it is advanced packaging for AI large models and high-end GPUs, or system-in-package commonly used in consumer electronics and automotive applications, higher demands are placed on packaging precision and automation. As a critical step in the packaging process, the performance of wafer dicing carriers has become a major factor constraining packaging efficiency and product yield.

DOHONE has long been the semiconductor packaging auxiliary equipment field, accurately identifying industry upgrade needs. The company's wafer dicing cassette, featuring an innovative "mushroom head + automatic lock" structural design as its core advantage, breaks through the technical limitations of traditional auxiliary equipment, providing the semiconductor packaging industry with efficient, safe, and highly adaptable automation solutions, helping enterprises break through production bottlenecks and keep pace with the development rhythm of advanced packaging technologies.

As the wave of intelligent manufacturing sweeps through the semiconductor industry, workshop automation and unmanned operation have become inevitable trends in industrial upgrading. Automated equipment such as overhead cranes and industrial robots are widely used in wafer transfer, dicing, and other processes, greatly improving production efficiency and reducing human operational errors. However, traditional wafer dicing cassettes, constrained by structural design flaws, cannot efficiently work in coordination with workshop overhead cranes and robots. Issues such as insufficient positioning accuracy, inconvenient gripping, and wafer wobble or detachment during transfer not only affect the operational efficiency of automated production lines but can also lead to wafer breakage, resulting in unnecessary cost losses, making this a core pain point constraining automation upgrades in the packaging process.

Targeting this industry pain point, DOHONE, leveraging deep technical accumulation and precise market insight, has taken the lead in breaking through traditional design bottlenecks. The company has innovatively proposed an overall design solution that adds a mushroom head structure to the top of the wafer dicing cassette and incorporates an automatic locking mechanism at the bottom, fundamentally solving the core challenges of automated wafer dicing operations. The top mushroom head structure, precision-made from lightweight, high-strength materials, is specifically designed to meet the gripping requirements of workshop overhead cranes and robots, providing precise positioning and stable gripping, enabling quick cassette pickup, placement, and transfer, thereby greatly improving automated transfer efficiency. The embedded automatic locking design achieves convenient operation of "lock when lifted, release when placed," automatically locking the cassette when it is gripped and transferred, firmly securing the wafers, effectively preventing wafer drop and breakage caused by wobble or tilting during transfer, greatly enhancing wafer transfer safety. At the same time, it eliminates the need for manual locking, further reducing human operational steps and facilitating a fully automated closed-loop process. Verified by practical application, this design can improve wafer transfer efficiency by 5% to 10%, significantly reduce the wafer breakage rate, reduce cost losses for enterprises, and significantly improve production stability.

Considering the diversity of semiconductor packaging manufacturing processes, different chip products and dicing equipment have differentiated requirements for wafer cassette layer counts and dimensions. DOHONE adheres to the philosophy of "precise adaptation and customization on demand," designing two specifications of wafer cassettes—13-layer and 25-layer—according to the technical parameters and production process requirements of different dicing equipment, achieving comprehensive coverage of various scenarios. The 13-layer wafer cassette is suitable for medium-to-low capacity, small-batch packaging production scenarios, with a compact structure and convenient operation, flexibly matching small and medium-sized dicing equipment to meet routine wafer dicing transfer needs. The 25-layer wafer cassette is designed for large-scale, high-capacity packaging production lines, effectively increasing wafer carrying capacity, reducing the number of cassette transfers, matching high-end precision dicing equipment, accommodating the multiple-batch, high-efficiency production demands of advanced packaging, and helping enterprises improve mass production efficiency.

Today, competition in the semiconductor packaging industry is increasingly fierce. Efficient, precise, and automated auxiliary equipment has become key for enterprises to enhance their core competitiveness. The DOHONE Wafer Dicing Cassette, with its innovative design solving industry pain points, diverse specifications adapting to different processes, and high-quality materials ensuring product reliability, not only provides semiconductor packaging companies with efficient and convenient solutions but also helps drive the entire semiconductor packaging industry's upgrade toward automation, precision, and scale, injecting strong momentum into the autonomous and controllable development of the global semiconductor industry.