NEWS

In the precision workflows of semiconductor manufacturing, a 12-inch wafer must be cut into thousands of individual chips, a process known as "dicing." The 12-inch Wafer Frame Cassette serves as a core carrier in this step, leveraging its metal-based rigid structure and precision design to fulfill three critical tasks: protecting the wafer, securing its position, and minimizing damage. It can be described as the "safety guardian" of chip manufacturing.

During dicing, a high-speed rotating diamond blade spins at tens of thousands of revolutions per minute to cut the wafer, generating impact forces of up to several hundred newtons. If the wafer were placed directly on a standard carrier, the cutting stress could cause the wafer edges to chip or even lead to the entire wafer cracking. In contrast, the wafer frame cassette, made of aluminum alloy, effectively disperses cutting stress through its rigid structure.

The durability of the 12-inch Wafer Frame Cassette far surpasses that of plastic carriers: it can withstand temperature shocks from -40°C to 150°C, exhibits strong corrosion resistance, and has a single-unit service life of over five years. After adopting reusable frame cassettes, one packaging facility reported an annual reduction of 10 tons in plastic waste and a 60% decrease in carrier procurement costs.

From providing rigid support and precise positioning to contamination prevention and recycling, the 12-inch Wafer Frame Cassette uses the strength and precision of metal to build a safety barrier for the "cutting step" in chip manufacturing. As the industry advances toward processes below 2 nanometers, this "small carrier" is becoming a key infrastructure component that helps push physical limits while ensuring chip reliability.