NEWS

Currently, the global semiconductor industry is rapidly advancing toward higher precision, higher integration, and miniaturization. The continuous breakthroughs in chip performance, stringent control of product reliability, and steady improvements in mass production efficiency increasingly depend on technological advancements in core manufacturing processes such as packaging, heat treatment, and dispensing. As the "back-end core" of the semiconductor industry chain, the technical threshold of these key processes continues to rise alongside industry upgrades. Their process capability directly determines the quality of a chip's transition from design prototype to end application, making them a crucial lever for overcoming bottlenecks in high-end chip manufacturing and driving high-quality industry development.

Looking at precision placement in the chip packaging process, the adoption of advanced packaging technologies such as SiP and WLCSP has placed extremely high demands on placement accuracy, component adaptability, and production efficiency. These technologies must handle complex scenarios such as micro-solder ball components and fine pitches, avoiding quality fluctuations caused by impact on components and solder paste. This requires specialized equipment with high-speed placement, precise positioning, and full-process quality traceability. For example, FUJI's solutions achieve a high output of 120,000 cph, accurately accommodating different component heights and panel positioning requirements. In the high-efficiency heat treatment process, whether for reflow soldering or AI computing board soldering, equipment must precisely maintain temperature curves and control oxygen distribution to address challenges such as temperature variations between large and small components and thermal warpage. Equipment from companies like Rehm Thermal Systems and Essemtec achieves both energy savings and quality improvements through technologies such as intelligent temperature control and vacuum soldering, perfectly meeting the stringent requirements of semiconductor packaging. Meanwhile, micro-dispensing in the packaging process, as a critical step for protecting chips and enhancing stability, requires ultra-micro fluid control at the picoliter and nanoliter levels to meet diverse needs such as underfill and encapsulation sealing. Dispensing equipment from manufacturers like Musashi and Mingsai Technology effectively resolves industry challenges like incomplete filling and void formation through advantages such as high-precision glue volume control and parallel operation of multiple valves, supporting the development of chip miniaturization and high integration. It can be said that breakthroughs in each nuanced process rely heavily on the support of professional equipment, making equipment innovation and upgrading a core driver for semiconductor industry advancement.

Against this industry backdrop, the upcoming Electronica China, to be held from March 25 to 27, 2026, at the Shanghai New International Expo Centre (Halls E1-E5, W1-W4), serves as a crucial platform for consolidating industry strength and driving technological innovation. As a benchmark exhibition in the electronics manufacturing industry, this year's event spans a display area of nearly 100,000 square meters and features over 1,100 exhibitors. It focuses on demands across sectors such as automotive, industrial, communications electronics, and medical electronics, presenting an "innovation feast" covering the entire electronics production industry chain, with a spotlight on smart factories, new energy vehicle technologies, and the digital future. The exhibition brings together top-tier global manufacturers in the field of specialized semiconductor manufacturing equipment, showcasing cutting-edge equipment and comprehensive chain solutions for core processes like packaging placement, heat treatment, and dispensing. From Mycronic's solder paste jet printers to Tensun's underfill equipment, from Axis' precision dispensing equipment to Guangdong Kaite Precision's core transmission components, a wide array of innovative equipment tailored to industry needs is on display. This helps enterprises tackle technical challenges, break through mass production bottlenecks, and drive process improvement through equipment innovation, laying a solid foundation and injecting momentum for the high-quality development of the semiconductor industry. It serves as a core bridge for Sino-foreign exchange in electronics manufacturing technology, propelling China's electronics manufacturing from "scale leadership" to "technology leadership."

As a company deeply engaged in the semiconductor field, focusing on the R&D and service of semiconductor carriers, DOHONE consistently keeps pace with industry development, closely monitors technological frontiers and market demands, and is committed to providing industry customers with superior, better-suited semiconductor carrier products. For this Electronica China, DOHONE specifically dispatched a professional team comprising technical experts and marketing specialists to visit and learn on-site, gaining in-depth insights into equipment innovation trends in core processes such as packaging, heat treatment, and dispensing. By drawing on advanced industry technologies and solutions, DOHONE aims to precisely understand the adaptation requirements and upgrade directions for semiconductor carriers. Looking ahead, leveraging the insights gained from this visit, DOHONE will deeply integrate cutting-edge industry concepts with its own technological strengths, continuously optimize product design and manufacturing processes, enhance the precision, reliability, and adaptability of its semiconductor carriers, and further refine its service system. The company strives to provide semiconductor enterprises with more targeted and efficient product support, assisting downstream customers in improving production efficiency and reducing manufacturing costs, and collaborating with industry peers to jointly promote the high-quality development of the semiconductor industry.