Why Is A Wafer Ring Needed To Support The Dicing Tape During Wafer Dicing?
2025-08-29
Wafers from the semiconductor foundry require back grinding to reduce their thickness to meet packaging specifications. After grinding, the clean and intact wafer is mounted onto the dicing tape. Simply placing the wafer onto the tape is insufficient, as this would prevent the product from being loaded into a cassette. At this stage, a wafer frame is needed to support the dicing tape and secure the wafer, ensuring it is protected from external impact, facilitating easier and faster handling and storage, and preventing the scattered loss of individual die after dicing.
How is the dicing tape used to support the wafer? First, the film mounting machine is activated, and the wafer frame is placed into its designated position. Then, the cleaned wafer is placed onto the dicing tape already spread over the wafer frame for fixation. Finally, the secured wafer is placed into a wafer cassette, preparing the product for the next step in the process.
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