NEWS
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Why Is A Wafer Ring Needed To Support The Dicing Tape During Wafer Dicing?
Wafers from the semiconductor foundry require back grinding to reduce their thickness to meet packaging specifications. After grinding, the clean and intact wafer is mounted onto the dicing tape.
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Global Semiconductor Market Size Sees Steady Growth in 2025, with DOHONE Contributing Modestly
According to semiconductor industry data, the global semiconductor market reached $180 billion in the second quarter of 2025, reflecting a 7.8% increase from the first quarter of 2025 and a 19.6% rise compared to the second quarter of 2024.
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Why Are 12-Inch Wafers So Important
A 12-inch wafer is a circular thin slice made of monocrystalline silicon, serving as the fundamental material for semiconductor manufacturing and the core carrier of integrated circuits.
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Advantages of DOHONE 8-inch 25-Slot Wafer Frame Cassette
In the back-end process of IC packaging and testing in the semiconductor industry, the 8-inch 25-Slot Wafer Frame Cassette plays a crucial role.
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What Are The Main Market Applications Of 8-Inch Wafers
8-inch semiconductor silicon wafers are a critical component of integrated circuits (ICs), such as those used to power computers, mobile phones, and various other electronic devices.
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Current Technological Development Status of 6-Inch Wafer Dicing in the Semiconductor Chip Manufacturing Industry
In the semiconductor chip manufacturing sector, wafer dicing is a critical process that separates numerous chips on a wafer into individual units.
