NEWS
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SK Hynix: Yield of HBM Hybrid Bonding Process Improved
SK Hynix has announced a significant yield improvement in its hybrid bonding process for High-Bandwidth Memory (HBM), according to the company’s technical leadership.
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DOHONE Precision Jigs – Engineered from 7075 Aluminum for High-Frequency Production Lines
DOHONE precision jigs are manufactured entirely from high-strength 7075 aluminum alloy, a material widely recognized for its exceptional mechanical properties and fatigue resistance.
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Samsung Electro-Mechanics Joins NVIDIA's Core Supply Chain, Supporting Mass Production of the Groq3 LPU Chip
Amid the rapid iteration of the global AI industry and the surging demand for AI inference, the supply chain landscape for core semiconductor components is being continuously reshaped.
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DOHONE Wafer Dicing Cassette: Empowering the Automation Upgrade of Semiconductor Packaging
As the global semiconductor industry rapidly iterates toward high precision, high integration, and miniaturization, chip manufacturing processes continue to break through to 3nm and below.
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Choose the Right Wafer Frame Cassette to Avoid Fatal Hazards in Semiconductor Production – DOHONE Ensures Quality Protection
In semiconductor wafer processing, the Wafer Frame Cassette, as a core component for wafer storage, transport, and dicing, directly determines the stability, efficiency, and safety of production through its quality and precision.
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The NAND Flash Supercycle Under the AI Wave: Soaring Prices and Structural Industry Transformation
The global semiconductor industry is currently experiencing a strong recovery, and the surge in NAND flash prices is undoubtedly the core engine and strongest driving force behind this rebound.
