NEWS
-
Why Is A Wafer Ring Needed To Support The Dicing Tape During Wafer Dicing?
Wafers from the semiconductor foundry require back grinding to reduce their thickness to meet packaging specifications. After grinding, the clean and intact wafer is mounted onto the dicing tape.
-
Global Semiconductor Market Size Sees Steady Growth in 2025, with DOHONE Contributing Modestly
According to semiconductor industry data, the global semiconductor market reached $180 billion in the second quarter of 2025, reflecting a 7.8% increase from the first quarter of 2025 and a 19.6% rise compared to the second quarter of 2024.
-
Shenzhen DOHONE Turnover Storage Solutions Team's Qingyuan Two-Day One-Night Adventure Retreat
Shenzhen DOHONE Turnover Storage Solutions has always prioritized enabling employees' dreams and well-being, creating diverse recreational programs for its entire workforce.
-
Shenzhen DOHONE's Turnover and Storage Products Strengthen
Shenzhen DOHONE's Turnover and Storage Products Strengthen and Upgrade Industrial Chains towards High-end Applications, Supported by 100+ Enterprise Implementation Cases
-
DOHONE Announces Achievement of September Target with Cash Dividend Distribution
Through the concerted efforts of all Donghongxin (DOHONE) family members in September, the company's order volume reached a historic high since its establishment
-
October Recruitment Plan
Established in 2003, we possess an experienced engineering and production team alongside advanced precision machinery, delivering one-stop customized solutions for electronic/semiconductor material handling and storage products.
