NEWS
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Current Technological Development Status of 6-Inch Wafer Dicing in the Semiconductor Chip Manufacturing Industry
In the semiconductor chip manufacturing sector, wafer dicing is a critical process that separates numerous chips on a wafer into individual units.
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DOHONE March Target Achievement Awards Ceremony
Since the beginning of 2021, DOHONE has been operating at full capacity with a steady stream of orders. Through the collective efforts of all employees in March, the company successfully achieved its monthly shipping targets.
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Wafer Cassette Manufacturer Deploys Long-Stroke Precision Machining Systems
Wafer cassette manufacturer deploys long-stroke precision machining systems, enabling faster batch customization and accelerated delivery.
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DOHONE 6-Inch 13-Slot Wafer Frame Cassette Revolutionizing Wafer Transfer Experience
In the precision-driven field of semiconductor manufacturing, the DOHONE 6-Inch 13-Slot Wafer Frame Cassette stands out as an efficient solution for wafer transfer with its groundbreaking auto-locking design.
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DOHON April Target Achievement Awards Ceremony
The most anticipated moment of the month has arrived again. Through the collective efforts of all Donghongxin employees in April, we successfully achieved our monthly targets.
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Dohone Achieves May Performance Targets - Employee Bonus Distribution
May brings rising temperatures, yet this fails to dampen the dedication of Dohone’s workforce. Every employee dedicates themselves fully to their responsibilities – collective commitment drives our corporate targets.
