PRODUCTS

The DOHONE 8 inch Wafer Frame is precision-machined from high-quality SUS420J2 stainless steel, offering high material strength, excellent rigidity, and wear resistance to meet the demands of long-term stable use in semiconductor processes. The product surface is finely ground and polished, achieving a stable surface roughness controlled within Ra 0.08–0.17 μm. Its high flatness and smooth finish ensure tight and uniform adhesion between the blue tape and the wafer frame.

In practical application, the taping process is smooth and reliable, with minimal risk of bubble formation and no edge lifting or detachment, effectively improving taping yield and processing stability. Whether used in wafer dicing, thinning, grinding, or transfer processes, the DOHONE 8-inch wafer frame provides strong support for blue tape adhesion and wafer fixation. It is a reliable and efficient assistant in semiconductor wafer processing.

Warranty Period for Wafer Frames

A 6-month warranty is provided from the date of sale (excluding product damage caused by human factors).

Q&A

Are you a factory or a trading company?

We are a factory.

How many staffs do you have in your factory?

Our company has nearly 70 staffs.

How many years have your company made this kind of equipment?

Our company has been serving the semiconductor industry for over 20 years, with extensive expertise in design and manufacturing.

What kinds of information do you need for a quote?

In order to quote for you earlier, please provide us with the following information together with your inquiry.

1.Detailed drawings(STEP,CAD,SOLID Works,DXF,PDF)

2.Material requirement(SUS420J2,SUS304)

3.Surface treatment(Anodized，Hard Anodized，plating,sandblasting,brushing,etc)

4.Quantity(per order/per month/annual)

5. Any special demands or requirements, such as packing, delivery, labels, etc.

6.when do you expect to need the product?