PRODUCTS

DOHONE 12-inch wafer frame utilizes a dual core manufacturing process of precision surface polishing + specialized heat treatment, achieving a dual upgrade from surface quality to internal material properties, providing highly reliable support for advanced semiconductor packaging and wafer processing.

At the manufacturing process level, the product undergoes high-precision mirror-grade surface polishing, effectively reducing surface roughness to an extremely low level. This achieves a burr-free, pit-free ultra-flat mirror finish, completely eliminating fitting issues caused by surface imperfections found in conventional frames. The accompanying specialized heat treatment process, through precise temperature control and uniform annealing, optimizes the internal crystal arrangement of the material and releases residual processing stress. This significantly enhances overall hardness, bending strength, and dimensional stability, ensuring resistance to warping and deformation during long-term cyclic use and under high and low-temperature conditions, thereby guaranteeing consistent wafer carrier precision.

Leveraging this dual-process foundation, the product delivers two core application advantages in practical production, directly empowering process yield and cost control:

Bubble-Free Film Lamination, Enhancing Process Yield

The ultra-smooth mirror surface enables complete and intimate contact between the blue film and the frame, fundamentally eliminating issues like bubbles, wrinkles, and localized edge lifting. In processes such as wafer mounting, thinning, and dicing, stable film tension prevents defects like wafer shift, scratches, and chipping, significantly reducing rework rates and wafer breakage loss, effectively enhancing overall process yield and production stability.

High Stability and Durability, Reducing Long-Term Costs

The material, strengthened by heat treatment, exhibits excellent fatigue resistance, high-temperature tolerance, and resistance to clamping wear. It can withstand demanding, high-frequency operating conditions in automated production lines, including repeated clamping, high-temperature baking, and chemical cleaning. The product's service life is significantly extended, reducing the frequency of replacement. This lowers enterprise costs related to frame procurement, storage, and changeover downtime, making it suitable for the high-volume, high-throughput demands of advanced packaging lines.

Overall, the DOHONE 12-inch wafer frame combines precision craftsmanship with reliable quality, balancing fitting accuracy with long-term durability. It serves as an ideal supporting component for critical processes such as 12-inch wafer thinning, dicing, and mounting, helping semiconductor manufacturing achieve higher yields and lower operational costs.

Q&A

Are you a factory or a trading company?

We are a factory.

How many staffs do you have in your factory?

Our company has nearly 70 staffs.

How many years have your company made this kind of equipment?

Our company has been serving the semiconductor industry for over 20 years, with extensive expertise in design and manufacturing.

What kinds of information do you need for a quote?

In order to quote for you earlier, please provide us with the following information together with your inquiry.

1.Detailed drawings(STEP,CAD,SOLID Works,DXF,PDF)

2.Material requirement(SUS420J2,SUS304)

3.Surface treatment(Anodized，Hard Anodized，plating,sandblasting,brushing,etc)

4.Quantity(per order/per month/annual)

5. Any special demands or requirements, such as packing, delivery, labels, etc.

6.when do you expect to need the product?

What is your MOQ?

Standard products are available in stock with no minimum order quantity (MOQ) restrictions.

Complies with mainstream semiconductor equipment requirements