PRODUCTS

In the field of semiconductor chip manufacturing, the selection of materials and process control for auxiliary materials such as wafer rings are crucial. Our company's 12-inch wafer ring is a masterpiece in this field. It carefully selects SUS420J2 material as the base material, embarking on a journey of exceptional quality.

SUS420J2 belongs to martensitic stainless steel, and its unique chemical composition endows it with inherent excellent characteristics. From the very beginning of production, from ore smelting to steel forming, every step follows strict industrial standards to ensure the purity and stability of the material. Subsequently, through advanced laser cutting processing technology, it is cut into the prototype of a 12-inch wafer ring.

However, this is just the beginning. To further enhance product performance, the heat treatment process becomes a critical step. In a professionally designed heat treatment furnace, the wafer ring is accurately heated to a specific temperature range, with the temperature control precise to a minimal error range, ensuring an ideal transformation of the internal structure of the steel. As the temperature rises and falls, carbon atoms diffuse and arrange in an orderly manner, resulting in a leap in the hardness of the wafer ring.

This high hardness characteristic directly translates into excellent resistance to bending. In practical usage scenarios, whether it is withstanding lateral compression or resisting vertical bending forces, the wafer ring can steadily rebound. For example, when it is installed on precision film mounting equipment, vibrations and minor collisions from surrounding components cannot cause structural damage; or during the film mounting and handling process, occasional improper forces can also be easily resolved by its excellent resistance to bending.

Even more remarkably, under the of repeated use, whether it is undergoing ten, a hundred, or even more cycles of film mounting operations, it will not show any deformation, safeguarding continuous and stable production operations, making it the trusted choice for many semiconductor manufacturing enterprises.

Delivery Lead Time for Wafer Frames

For standard 6-inch/8-inch/12-inch wafer frames (quantities under 500 pieces), the typical lead time is 2-5 working days for shipment. For larger quantities or other non-standard products, the delivery timeline will be negotiated separately and specified in the contract.

Product Packaging Method? Our products are first protected internally with? customized specialized plastic bags? then placed into? heavy-duty cartons? designed for secure packaging (additional charges apply for specialized configurations). For long-distance transportation?wooden crates? are added externally to ensure safe delivery to your hands.

Shipping Methods

We collaborate with clients to determine the optimal shipping method, prioritizing cost efficiency. For international small-volume orders, we typically use air freight or international courier services. For large-volume orders, sea freight is employed to ensure economical delivery.

Q&A

Are you a factory or a trading company?

We are a factory.

How many staffs do you have in your factory?

Our company has nearly 70 staffs.

How many years have your company made this kind of equipment?

Our company has been serving the semiconductor industry for over 20 years, with extensive expertise in design and manufacturing.

What kinds of information do you need for a quote?

In order to quote for you earlier, please provide us with the following information together with your inquiry.

1.Detailed drawings(STEP,CAD,SOLID Works,DXF,PDF)

2.Material requirement(AL6061,AL7075,SUS420J2,SUS304)

3.Surface treatment(Anodized，Hard Anodized，plating,sandblasting,brushing,etc)

4.Quantity(per order/per month/annual)

5. Any special demands or requirements, such as packing, delivery, labels, etc.

6.when do you expect to need the product?

What is your MOQ?

Standard products are available in stock with no minimum order quantity (MOQ) restrictions.