12 Inch 13 Slot E12-R3 Metal Wafer Cassette (20 mm Slot Pitch)

Product Name: 12 Inch 13 Slot E12-R3 Metal Wafer Cassette (20 mm Slot Pitch)

Number: DSF21E12-000-R3

Size: 316.5(L)×316.5(W)×315.1(H)mm

Material: Aluminum alloy(AL7075)

Number of slots: 13 slots

Slot Pitch: 20 mm

Initial slot position: 42 mm

Product Process: CNC precision machining

Surface treatment: Hard Anodizing

Supported Wafer Diameter: 300 mm

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Product Description

12 Inch 13 Slot E12-R3 Metal Wafer Cassette (20 mm Slot Pitch)

12 Inch 13 Slot E12-R3 Metal Wafer Cassette (20 mm Slot Pitch)

12 Inch 13 Slot E12-R3 Metal Wafer Cassette (20 mm Slot Pitch)

12 Inch 13 Slot E12-R3 Metal Wafer Cassette (20 mm Slot Pitch)

 

As the core bearing solution for high-temperature processes in semiconductor manufacturing, the DOHONE 12-Inch Metal Wafer Cassette is tailor-made for wafer baking processes. Through rigorous material selection and precision engineering design, it has become the preferred carrier for high-reliability production scenarios. The main body of the product is integrally formed from aerospace-grade 7075 aluminum alloy, a material that ensures structural reliability for wafer bearing from the source, thanks to its excellent mechanical strength, thermal conductivity stability, and fatigue resistance. The surface undergoes precision hard anodizing treatment to form a dense and uniform protective film, which not only significantly enhances wear resistance and corrosion resistance but also achieves an extremely low particle release rate, fundamentally avoiding the risk of process contamination.

 

To meet the stringent requirements of the 300°C high-temperature baking environment, DOHONE employs thermodynamic material optimization and structural stress simulation design, endowing the product with exceptional high-temperature stability. During long-term high-temperature cyclic operations, it maintains a zero-shedding cleanliness standard while effectively resisting deformation caused by thermal expansion and contraction, with dimensional accuracy consistently maintained within micrometer-level error ranges. Its robust frame structure and precise wafer slot design ensure secure positioning and uniform heating of 12-inch wafers, guaranteeing wafer flatness and performance consistency throughout the baking process.

 

Certifications

In today's highly competitive technology manufacturing sector, DOHONE has earned the prestigious ISO9001 Quality Management System Certification through its exceptional R&D capabilities and rigorous quality control framework. This certification not only authoritatively validates the company’s compliance with international management standards but also solidifies its commitment to delivering high-quality products and services to clients.

 

Notably, the company’s independently developed wafer cassette — a critical tool in semiconductor production — embodies the intellectual achievements of its R&D team and holds exclusive design patents. From initial conceptualization and iterative simulation testing to final product validation, every phase adheres to meticulous standards. This ensures the wafer cassette delivers outstanding stability and precision compatibility in complex semiconductor environments, empowering chip manufacturers to enhance efficiency, reduce defect rates, and drive global semiconductor innovation.

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